Flexible Electronics News

New Standard Allows Stacked Dies in 3D ICs to Connect with Test Equipment

An imec-initiated industry collaboration leads to publication of IEEE Std 1838TM for test access architectures for 3D-ICs.

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By: DAVID SAVASTANO

Editor, Ink World Magazine

imec announced that IEEE Std 1838TM-2019 – recently approved by the IEEE Standards Association – will be included in IEEE Xplore Digital Library from February 2020 onward. The new standard allows die makers to design dies which, if compliant to this standard, constitute, once stacked in a 3D-IC by a stack integrator, a consistent stack-level test access architecture. The standardization effort of the 3D-DfT (design-for-test) was initiated by imec. 3D-ICs exploit the vertical dimension for furth...

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